1,1,3,3-Tetramethyldisilazane CAS 15933-59-2

Introduction：Basic information about 1,1,3,3-Tetramethyldisilazane CAS 15933-59-2, including its chemical name, molecular formula, synonyms, physicochemical properties, and safety information, etc.

1,1,3,3-Tetramethyldisilazane Basic information

• Product Name: 1,1,3,3-Tetramethyldisilazane
• Synonyms: Bisdimethylsilylamine;Disilazane, 1,1,3,3-tetramethyl-;N-(Dimethylsilyl)(dimethyl)silanamine;n-(dimethylsilyl)-1,1-dimethyl-silanamin;N-(dimethylsilyl)-1,1-dimethyl-Silanamine;Silanamine, N-(dimethylsilyl)-1,1-dimethyl-;TETRAMETHYLDISILAZANE;TMDS
• CAS: 15933-59-2
• MF: C4H15NSi2
• MW: 133.34
• EINECS: 240-072-2
• Product Categories: Chemical Synthesis;Organometallic Reagents;Organosilicon;Analytical Chemistry;Dimethylsilylation (GC Derivatizing Reagents);GC Derivatizing Reagents;Si (Classes of Silicon Compounds);Si-H Compounds;Silazanes;Silylation (GC Derivatizing Reagents);Si-N Compounds
• Mol File: 15933-59-2.mol

1,1,3,3-Tetramethyldisilazane Chemical Properties

• Melting point: 99-100 °C
• Boiling point: 99-100 °C
• density: 0.752 g/mL at 25 °C(lit.)
• refractive index: n20/D 1.404(lit.)
• Fp: 17 °F
• storage temp.: Store below +30°C.
• solubility: Miscible with common organic solvents.
• pka: 9.80±0.70(Predicted)
• form: clear liquid
• color: Colorless to Almost colorless
• Specific Gravity: 0.752
• Sensitive: Moisture Sensitive
• Hydrolytic Sensitivity: 7: reacts slowly with moisture/water
• BRN: 741869
• InChI: 1S/C4H15NSi2/c1-6(2)5-7(3)4/h5-7H,1-4H3
• InChIKey: NQCZAYQXPJEPDS-UHFFFAOYSA-N
• SMILES: [H][Si](C)(C)N[Si]([H])(C)C
• CAS DataBase Reference: 15933-59-2(CAS DataBase Reference)
• EPA Substance Registry System: Silanamine, N-(dimethylsilyl)-1,1-dimethyl- (15933-59-2)

Safety Information

• Hazard Codes: F,Xi
• Risk Statements: 11-36/37/38
• Safety Statements: 16-26-36
• RIDADR: UN 2924 3/PG 2
• WGK Germany: 3
• F: 10-21
• TSCA: TSCA listed
• HazardClass: 3
• PackingGroup: II
• HS Code: 29319090
• Storage Class: 3 - Flammable liquids
• Hazard Classifications: Eye Irrit. 2 Flam. Liq. 2 Skin Irrit. 2 STOT SE 3

1,1,3,3-Tetramethyldisilazane Usage And Synthesis

Chemical Properties

Clear colorless to faintly yellow liquid

Physical properties

bp 99–100 °C; n20D 1.4040; d 0.752 g cm?3.

Uses

Tetramethyldisilazane is used as a gas chromatographic derivatizing reagent. Further, it reacts with phenol to prepare dimethylphenoxysilane. In addition, it is used in electronic, polymer and pharmaceutical industries.

Uses

1,1,3,3-Tetramethyldisilazane is widely used in intramolecular hydrosilation of allyl alcohols, homoallylalcohols, and homopropargyl alcohols for the regio- andstereoselective synthesis of polyols

Properties and Applications

The ICP CVD synthesis of SiCxNy: H thin films using 1,1,3,3-tetramethyldisilazane (TMDSZ ) as a single-source precursor and argon as a gas-activator[1]. Using TMDSZ as the single-source compound produced amorphous hydrogenated silicon carbonitride (a-SiCN: H) films, whereas no such films were formed when HMDSZ was used, which was attributed to the lack of Si–H bond in HMDSZ. Under the collision-free condition, the formation of ?CH3, NH3, and DMSA was demonstrated from the decomposition of TMDSZ on the heated W filament. Free-radical short-chain reactions dominate the secondary gas-phase reactions of TMDSZ in the reactor setup. The short-chain reaction is initiated by the formation of methyl radicals via the cleavage of the Si–CH3 bonds of TMDSZ. The H abstraction by the produced methyl radicals from the Si–H or the C–H bond in various stable molecules (e.g., TMDSZ) propagates the chain with a resulting radical, which recombines with another radical to terminate the chain reactions, producing a series of products in the high-mass region[2].

References

[1] Maksim N. Chagin. “Synthesis, Properties and Aging of ICP-CVD SiCxNy:H Films Formed from Tetramethyldisilazane.” Coatings (2022).
[2] James Michael Stevenson, Eric Ampong and Yujun Shi*. “Understanding the Reaction Chemistry of 1,1,3,3-Tetramethyldisilazane as a Precursor Gas in a Catalytic Chemical Vapor Deposition Process.” The Journal of Physical Chemistry A 127 44 (2023): 9185–9195.